FUTURE TRENDS TOWARD POWER ELECTRONICS SYSTEM INTEGRATION VIA MODULAR BUILDING BLOCK APPROACH
Fred C. Lee
The Center for Power Electronics System’s (CPES) research vision is to develop an integrated system approach via integrated power electronics modules (IPEMs). The impact of improvements on power electronics technologies and system integration via the IPEM approach can be compared to the impact being realized by improvements in very- large-scale integrated (VLSI) circuit technology. Applications of VLSI circuit technology have enabled rapid advances in information technology and the digital revolution, accompanied by a steady increase in standardization, modularization, functional integration, and a steady decrease in manufacturing costs and equipment. Parallel to this integrated circuit development, the IPEM approach makes possible increased levels of integration in the components that comprise a power electronics system – devices, circuits, controls, sensors and actuators – which are integrated into manufacturable subassemblies and modules that, in turn, can be customized for a particular application. A competitive advantage will begin by industries that can quickly and efficiently provide their customers with a level of standardization and flexibility that is now routine in VLSI circuit technology. Moreover, as processes are being established, industries that make use of IPEMS' standardized components, subassemblies and modules will be able to enjoy the savings associated with the economics of scale.
This talk will briefly discuss the technology advancements needed to improve the characteristics of power electronic systems. Among these technologies being developed are planar metallization device interconnects, allowing three-dimensional integration of power devices, as well as the integration of power passives to increase the power density as they dominate the physical size of the system. Furthermore, possible integration of EMI filters in order to minimize some of the circuit parasitics detrimental to its ability to attenuate high-frequency noises will be discussed. The technologies being developed will ultimately span a wide range of applications from distributed power systems to motor drives. The presentation will also discuss results obtained from the various technologies being developed within the research scope of CPES.